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FN3060 NTE30107 AD8309 BA100 248ELSQ 1G132 1N4932A 1N1434
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1. 2. 2.1 2.2
Item No.: 160622
This specification applies to GaP / GaP LED Chips Structure Mesa structure Electrodes p-side (anode) n-side (cathode) Au alloy Au alloy
3.
Outlines (dimensions in microns) p-Electrode p-Epitaxy GaP n-Epitaxy GaP 250 235 n-Electrode n-Epitaxy GaP n-Substrate GaP
235
110
Wire bond contacts can also be square 4. Electrical and optical characteristics (T=25C)
Parameter
Forward voltage Reverse current Luminous intensity *
Symbol
VF IR IV
Conditions
IF = 2 mA VR = 5 V IF = 2 mA
min
typ
1,95
max
2,20 10
Unit
V A cd nm
500
700
Peak wavelength P IF = 2 mA 568 * On request, wafers will be delivered according to luminous intensity classes Brightness measurement at OSA on gold plate 5. Packing Dice on adhesive film with 1) wire bond side on top 2) back contact on top 6. Labeling Type Lot No. IV typ min max Quantity
(c) 2004
OSA Opto Light GmbH Tel. +49-(0)30-65 76 26 83 Fax +49-(0)30-65 76 26 81 contact@osa-opto.com


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